Differences
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| Both sides previous revisionPrevious revisionNext revision | Previous revision | ||
| manual:camera_manual [2018/01/25 05:48] – [Back Panel] Igor Yefmov | manual:camera_manual [2022/04/04 23:32] (current) – external edit 127.0.0.1 | ||
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| - | ===== Top Plate ===== | + | ===== Top plate ===== |
| Most of the active electronic components are located on the top of the processor board. There is a layer of compressible thermal compound that connects the top of the processor board to the bottom of the top plate. Most of the heat in the camera is transferred via the top plate. | Most of the active electronic components are located on the top of the processor board. There is a layer of compressible thermal compound that connects the top of the processor board to the bottom of the top plate. Most of the heat in the camera is transferred via the top plate. | ||
| Line 124: | Line 124: | ||
| The air vents are located on the back plate as 3 sets of vertical openings and the left and right microphone grills on the front plate. These vents allow some flow of air through the camera and provide a path for any heat not transferred to the housing to escape. | The air vents are located on the back plate as 3 sets of vertical openings and the left and right microphone grills on the front plate. These vents allow some flow of air through the camera and provide a path for any heat not transferred to the housing to escape. | ||
| - | ==== Mounting | + | ==== Mounting |
| There are 2 common ways of physically attaching the camera: | There are 2 common ways of physically attaching the camera: | ||
| * standard ¼ X 20 tripod threaded hole in the bottom plate | * standard ¼ X 20 tripod threaded hole in the bottom plate | ||